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Place of Origin : China
Payment Terms : T/T
Delivery Time : 10 workdays
Mold Type : Injection
Tray Shape : Rectangular
Reusable : Yes
Packaging Details : CARTON, PALLET
Supply Ability : 2000PCS/Day
Certification : ROHS, ISO
Quality Assurance : Delivery Guarantee, Reliable Quality
Ic Type : BGA,QFP,QFN,LGA,PGA
MOQ : 1000
Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Clean Class : General And Ultrasonic Cleaning
Packing Level : Transport package
Brand Name : Hiner-pack
Capacity : 16x9=144 PCS
Model Number : HN24141
Color : Usually black or dark gray for ESD protection
Warpage : Warpage MAX 0.2mm
Incoterms : EXW, FOB, CIF, DDU, DDP
Cavity Size : 3.55x1.40x0.79 mm
Cleanroom Waffle Pack IC Trays are professional semiconductor packaging carriers designed for strict cleanroom production environments. Compliant with industry cleanroom-grade standards, these waffle pack trays provide reliable contamination control performance, and fully meet the safe handling requirements for delicate fine pitch IC chips.
Adopting standardized JEDEC grid structure, Cleanroom Waffle Pack IC Trays feature precise slot design and stable anti-pollution performance. They effectively isolate dust and particulate pollution damage, perfectly protect precision semiconductor chips from scratch and contamination during manufacturing operations.
Cleanroom Waffle Pack IC Trays deliver stable and durable chip loading performance. They are widely suitable for daily IC packaging, storage, transportation and testing workflows, keeping sensitive semiconductor chips clean, intact and stable in the whole industrial chain.
| Brand | Hiner-pack | ||
| Material | MPPO | ||
| Color | Usually black or dark gray for ESD protection | ||
| Outline Line Size | 50.7×50.7×7.4 mm | ||
| Matrix QTY | 16x9=144 PCS | ||
| Service | Accept OEM, ODM | ||
Cleanroom-grade Waffle Pack IC chip trays provide comprehensive reliable protection for integrated circuits throughout semiconductor manufacturing, packaging, inspection, testing, transportation and storage processes.
Featuring excellent contamination control performance, the trays perfectly protect ESD-sensitive fine pitch semiconductor chip devices. They are widely applied to fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing operations, as well as daily IC logistics turnover and inventory management.
Why Choose Us:
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Cleanroom Waffle Pack IC Trays for Contamination Control Images |