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Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

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Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

MOQ : 1000

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Packing Level : Transport package

Warpage : Warpage MAX 0.23mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Outline Line Size : 101.6×101.6×7 mm

Certification : ROHS, ISO

Model Number : HN25249

Mold Type : Injection

Capacity : 4×7=28 PCS

Payment Terms : T/T

Color : Black

Cavity Size : 20.25×10×0.1 mm

Tray Shape : Rectangular

Ic Type : BGA,QFP,QFN,LGA,PGA

Brand Name : Hiner-pack

Reusable : Yes

Packaging Details : CARTON, PALLET

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Precision Engineered Waffle Pack Chip Trays Solid PC for ESD Protection

Searching for reliable carrier for fragile IC parts? Hold tiny chips firmly inside neatly molded cavities. Block static charge buildup and avoid sudden electrostatic harm across production links. Keep every single component fixed without shifting during movement.


Feature rigid flat panel design with evenly arranged pockets. Fit automated test fixtures and pick place equipment perfectly. Cut abrasion and collision risk during repeated handling, inspection and transfer. Maintain consistent performance after long time circulation.


Accept custom cavity shapes depths and overall tray dimensions. Adjust layout to match unique chip outlines and footprint. Support small batch and mass production projects. Meet diverse requirements from electronic and semiconductor manufacturers.

Key Features/ Benefits
  • Precision shaped molded cavities
  • Precision shaped molded cavities
  • Anti scratch anti contamination
  • Anti scratch anti contamination
  • Black and red color option
Specifications
Brand Hiner-pack
Model HN25249
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 101.6×101.6×7.8 mm
Cavity Size 20.25×10×0.1 mm
Matrix QTY 4×7=28 PCS
Warpage MAX 0.23mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Support semiconductor production and chip testing workflows. Carry ICs while sorting and quality checking. Enable smooth part circulation inside workshops and assembly lines.


Fit electronic parts warehouse keeping. Support bulk chip outbound transport. Preserve component integrity before final assembly and packaging.

Packaging & Shipping/ Services

Pack inside anti static bags then export cartons. Proper stacking avoid surface marks. Provide various shipping choices. Track shipments after sending. Ensure safe arrival to worldwide clients.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

Solid PC Waffle Pack Chip Trays

      

ESD Protection Waffle Pack Trays

      

Precision Engineered Chip Trays

      
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